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The European Chips Skills Academy (ECSA) - Introduction and Educational Activities
In this video Bernd Deutschmann and Dominik Zupan introduce the European Chips Skills Academy (ECSA) project. The European Chips Skills Academy is a consortium of 18 partners from 12 countries aimed at aimed at addressing the growing skills and talent shortages in Europe’s microelectronics sector. Funded under the Erasmus+ Program, the Academy focuses on developing and delivering a range of training programs in fields like semiconductor technology, cybersecurity, and green skills. ECSA also focuses on building networks through the strategic creation of partnerships between stakeholders in the industry. Through skills quantification, the academy will measure and evaluate the development of skills in the sector.
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More information: chipsacademy.eu/
Instagram: europeanchipsskillsacademy
Linkedin: www.linkedin.com/company/european-chips-skills-academy
Переглядів: 138

Відео

VNA: Selected Topics (part 3/3)
Переглядів 3852 місяці тому
VNA: Selected Topics (part 3/3)
VNA: Homemade Cal Kit (part 2/3)
Переглядів 4502 місяці тому
VNA: Homemade Cal Kit (part 2/3)
VNA: First Measurements (part 1/3)
Переглядів 6062 місяці тому
VNA: First Measurements (part 1/3)
Sillicon Valley of Austria, January 2024
Переглядів 1633 місяці тому
Jan. 19, 2024 ife.tugraz.at #tugraz #microelectronics #siliconvalley
EMV Fachtagung 2024 TU Graz
Переглядів 2793 місяці тому
Sept. 18-20, 2024 ife.tugraz.at #tugraz #emc #emv
Monolithic Ultra Low Power Solar Harvester with High Dynamic MPPT Algorithm by Dr. Christoph Steffan
Переглядів 2334 місяці тому
Abstract: "Latest wearables and IoT sensors use intelligent nano-power circuits and devices that harvest energy from environmental sources such as light or heat. Historically, there has been a gap between the energy demands of these circuits and the energy available from harvesting sources. Presently, we are approaching the cross-point where available harvested energy can exceed the energy cons...
TOF 3D Imaging by Dr. Timuçin Karaca
Переглядів 9905 місяців тому
Abstract: "Indirect Time of Flight 3D imaging is an emerging technology used in 3D cameras. The technology is based on measuring the time of flight of modulated light. It allows to generate fine grain depth images with several hundreds of thousand image points. I-TOF has become a standard solution for face recognition and authentication. Recently I-TOF is also used in various new applications, ...
Correct Electronic Component Placement for EMI and EMC
Переглядів 7085 місяців тому
Bernd Deutschmann 439.210 Electromagnetic Compatibility of ICs Recorded on May 5, 2022 - Playlist: ua-cam.com/play/PLLpZ1DoEuR9v2GYs6KhyqT7nQQlRbHe3A.html - Institute of Electronics: www.ife.tugraz.at www.tugraz.at - Social Media: ife.tugraz.at ife.tugraz.at at.linkedin.com/company/ife-tugraz - iMooX: www.imoox.at #EMC #Electronics #TUGraz
Thermoelectric Energy Harvesting for Autonomous Systems by Dipl.-Ing. Harald Dillersberger
Переглядів 2105 місяців тому
Abstract: "Latest wearables and IoT sensors use intelligent nano-power circuits and devices that harvest energy from environmental sources such as light or heat. Historically, there has been a gap between the energy demands of these circuits and the energy available from harvesting sources. Presently, we are approaching the cross-point where available harvested energy can exceed the energy cons...
Wunsch-Bell Characterization
Переглядів 2065 місяців тому
Bernd Deutschmann 439.210 Electromagnetic Compatibility of ICs Recorded on May 5, 2022 - Playlist: ua-cam.com/play/PLLpZ1DoEuR9v2GYs6KhyqT7nQQlRbHe3A.html - Institute of Electronics: www.ife.tugraz.at www.tugraz.at - Social Media: ife.tugraz.at ife.tugraz.at at.linkedin.com/company/ife-tugraz - iMooX: www.imoox.at #EMC #Electronics #TUGraz
Millimeter Wave Wireless Sensing by Dr. Hao Gao
Переглядів 3245 місяців тому
Abstract: "Millimeter-Wave and sub-THz (mm-wave) wireless communication provides several to tens of GHz bandwidth. With frequency goes higher, the antenna size is also suitable for integrating with the active circuits either in the AoC or AiP, which generates a compact monolithic solution for the wireless circuit. In such a high integration level, the traditional bulky transmitter turns into an...
On-Chip Decoupling
Переглядів 4056 місяців тому
Bernd Deutschmann 439.210 Electromagnetic Compatibility of ICs Recorded on May 5, 2022 - Playlist: ua-cam.com/play/PLLpZ1DoEuR9v2GYs6KhyqT7nQQlRbHe3A.html - Institute of Electronics: www.ife.tugraz.at www.tugraz.at - Social Media: ife.tugraz.at ife.tugraz.at at.linkedin.com/company/ife-tugraz - iMooX: www.imoox.at #EMC #Electronics #TUGraz
Power supply sequencing and its considerations by Olga Kharko
Переглядів 3676 місяців тому
Abstract: "In the complex multiple power domain systems the suitable power supply sequencing is required in order to prevent the excessive current flow, latch up, as well as the long term reliability. This talk gives the overview about common design techniques for start up/down sequencing for analog and mixed-signal systems. Also it describes the power-on-reset circuit solutions, power ok, soft...
Signal Edge Shaping
Переглядів 2846 місяців тому
Bernd Deutschmann 439.210 Electromagnetic Compatibility of ICs Recorded on May 5, 2022 - Playlist: ua-cam.com/play/PLLpZ1DoEuR9v2GYs6KhyqT7nQQlRbHe3A.html - Institute of Electronics: www.ife.tugraz.at www.tugraz.at - Social Media: ife.tugraz.at ife.tugraz.at at.linkedin.com/company/ife-tugraz - iMooX: www.imoox.at #EMC #Electronics #TUGraz
Workflow to Improve EMC
Переглядів 3516 місяців тому
Workflow to Improve EMC
CMOS Output Drivers
Переглядів 5727 місяців тому
CMOS Output Drivers
Immunity: Surface Scan Method
Переглядів 2267 місяців тому
Immunity: Surface Scan Method
Immunity: Faraday Cage
Переглядів 5567 місяців тому
Immunity: Faraday Cage
Immunity: Bulk Current Injection
Переглядів 9167 місяців тому
Immunity: Bulk Current Injection
Immunity: Stripline Method
Переглядів 4108 місяців тому
Immunity: Stripline Method
Immunity: Direct Power Injection
Переглядів 8918 місяців тому
Immunity: Direct Power Injection
Immunity: TEM Cell
Переглядів 3428 місяців тому
Immunity: TEM Cell
EMC Immunity Test Signal
Переглядів 4668 місяців тому
EMC Immunity Test Signal
IC RF Immunity Overview
Переглядів 3108 місяців тому
IC RF Immunity Overview
EME Conclusion
Переглядів 1679 місяців тому
EME Conclusion
Faraday Cage Method
Переглядів 6339 місяців тому
Faraday Cage Method
Magnetic Probe Method
Переглядів 3259 місяців тому
Magnetic Probe Method
Stripline Method
Переглядів 3199 місяців тому
Stripline Method
Inductive Positions Sensors: Fundamentals and Applications by Dipl.-HTL-Ing. Josef Janisch
Переглядів 1,5 тис.10 місяців тому
Inductive Positions Sensors: Fundamentals and Applications by Dipl.-HTL-Ing. Josef Janisch

КОМЕНТАРІ

  • @RS-km7gl
    @RS-km7gl 12 годин тому

    Very deep and useful explanation. Thank you.

  • @der.Schtefan
    @der.Schtefan 5 днів тому

    OMG, thank god you mention that both variants (E-d, d-E) are mentioned on the Internet. For a moment I thought I started to go insane.

  • @LotecAvenue
    @LotecAvenue 10 днів тому

    Great video. I'd recommend you to go through the mathematics in more detail in later videos. My kids had to watch it, write down the math, and I had to explain it to them. They have a higher knowledge about electronics (due to technical hobbies) but they need 2 more years at school before they reach the math level to understand this straight away.

  • @plavy3594
    @plavy3594 12 днів тому

    Thanks a lot.

  • @leonshortg
    @leonshortg 17 днів тому

    Love the car EMC interference jolt 😅

  • @bushigongzuomayi
    @bushigongzuomayi 19 днів тому

    I understood perfectly not understanding😂😂 but I have got a clue and find it amazing! Great presentation🎉🎉🎉 Thank you!

  • @wolpumba4099
    @wolpumba4099 Місяць тому

    *Summary of "TOF 3D Imaging" by Dr. Timuçin Karaca* * *0:05** Introduction:* Dr. Timuçin Karaca, a former PhD graduate from God's University of Technology, currently working at Infineon Technologies, will discuss indirect Time of Flight (i-TOF) 3D imaging. * *1:08** Time of Flight Principle:* The talk introduces the time of flight principle, used in 3D cameras to measure distance by analyzing the time it takes for modulated light to travel to an object and reflect back. * *1:34** Application Examples:* i-TOF technology is used in various applications, including face recognition, computational photography, gesture recognition, robotics, and automotive in-cabin sensing (e.g., adaptive airbag deployment). * *2:14** Ranging Technologies:* Infineon focuses on two active ranging technologies: optical and radar. Optical technologies use active light, while passive technologies, like dual RGB cameras, are less common at Infineon. * *3:28** Flash vs. Scanning:* Flash illumination captures the entire scene at once, while scanning illuminates a small area and scans across the scene. * *4:12** Direct vs. Indirect Time of Flight:* Direct ToF measures the exact travel time of a light pulse. Indirect ToF modulates the emitted light and measures the phase shift between emitted and reflected light to determine distance. * *5:57** Historical Context:* An early experiment by Hippolyte Fizeau used the time of flight principle to measure the speed of light, demonstrating the principle's long-standing relevance. * *8:43** 3D i-TOF Camera Structure:* A typical 3D i-TOF camera consists of a pixel array, an external light source (usually a laser diode), and a processing unit. The chip controls the light source, measures the phase shift, and sends data to the processing unit for distance calculation. * *11:54** Pixel Arrays and Depth Images:* State-of-the-art i-TOF sensors have up to VGA resolution (300,000 pixels), with research pushing towards one megapixel. These sensors generate depth images, where pixel values represent distance. * *14:55** Photon Mixing Device:* Each pixel contains a photon mixing device with two readout nodes and modulation gates. By controlling the electric field, the device directs photo-generated electrons to either node, allowing phase detection. * *18:49** Electron Collection and Phase Shift:* The voltage difference between the readout nodes correlates with the phase shift, enabling distance measurement. * *19:49** Modulation Frequency:* A typical modulation frequency is 100 MHz, corresponding to a 3-meter unambiguous range. * *21:22** Ambiguity Resolution:* To resolve distance ambiguity, a second measurement with a 90-degree phase shift is performed, providing a unique distance solution. * *23:37** Data Processing:* The phase shift and amplitude are calculated from the pixel data, generating depth and grayscale-like images. * *25:37** Artifact Removal:* Four-phase measurements (0, 90, 180, and 270 degrees) are used to eliminate artifacts like stripes caused by readout chain offsets. * *29:45** Pixel Size and Technology:* State-of-the-art pixel sizes are around 5x5 micrometers, with research pushing towards smaller sizes. * *31:11** Circuit Design:* The control circuit in each pixel manages charge collection and readout, while a background illumination suppression (SBI) circuit improves dynamic range in bright conditions. * *38:08** Background Light Suppression:* The SBI circuit counteracts the effects of ambient light, such as sunlight, by adjusting current sources to maintain a constant node potential, extending dynamic range. * *44:45** Noise Sources:* Key noise sources include KT/C noise (related to capacitor charge storage), photon shot noise (due to the random nature of photon arrival), and readout noise from the readout circuitry. * *49:14** Frontside vs. Backside Illumination:* Frontside illumination (FSI) is simpler and cheaper but has lower quantum efficiency due to metal layer obstruction. Backside illumination (BSI) is more complex and expensive but offers higher quantum efficiency and is necessary for smaller pixel sizes. * *53:57** Process Improvements:* Techniques like prisms, buried trenches, and micro-lenses can enhance the performance of FSI sensors. * *57:52** BSI for Smaller Pixels:* For pixel sizes 5 micrometers or smaller, BSI is essential for achieving sufficient performance. * *58:24** Chip Components:* Besides the pixel array, the chip includes ADCs, a digital core for control and data storage, a PLL for frequency generation, an eye safety support block, a modulation signal generator, and power supply circuits. * *1:02:33** Chip Distribution:* Chips are distributed as bare die (for consumer applications) or packaged chips (for automotive and other applications requiring robustness). * *1:05:41** Camera Module Components:* Building a 3D camera requires a driver for the light source, a vertical cavity surface-emitting laser (VCSEL), a diffuser, a lens, and an optical filter. * *1:07:57** Optical Filter:* The optical filter is crucial for blocking sunlight and reducing photon shot noise. 940 nm lasers are often preferred due to a dip in the sunlight spectrum at that wavelength. * *1:12:54** Eye Safety:* Due to the powerful lasers used, eye safety is paramount. Various mechanisms, such as current monitoring, photodiodes for diffuser monitoring, and conductive coatings, are employed to ensure safety. * *1:17:42** Conclusion:* The talk concludes by emphasizing the importance of i-TOF technology and inviting questions from the audience. I used gemini-1.5-pro-exp-0827 on rocketrecap dot com to summarize the transcript. Cost (if I didn't use the free tier): $0.04 Input tokens: 29052 Output tokens: 1283

  • @Oldclunker-ge5zp
    @Oldclunker-ge5zp Місяць тому

    Very educational video ! I hope you have reduced the Y capacitors after adding the common mode choke. A value of 400 nF will trip the RCD. (Fehlerstrom-Schutzschalter 30mA). The max. allowed current through the earth conductor is 3.5 mA, which translates into approximately 50 nF. In practice, I have seen values of 2 nF or less.

  • @ajayraj-zj4ql
    @ajayraj-zj4ql Місяць тому

    I think the parasitic diode direction for pmos in TG is reversed

  • @ajayraj-zj4ql
    @ajayraj-zj4ql Місяць тому

    Wow very interesting 🎉

  • @welissonsantos5502
    @welissonsantos5502 Місяць тому

    I need a circuit designer urgent

  • @Optimuseq
    @Optimuseq Місяць тому

    2:47 any calculations/formulas for calculating LC?

  • @martinkaack7717
    @martinkaack7717 Місяць тому

    Hi Christoff, as per your drawings, in a series lcr circuit, the current is in phase as it passes through the resistor, capacitor, and the inductor, with the voltage either leading or lagging because of the respective impedance of 1/JWC or JWL.

  • @ehsanbahrani8936
    @ehsanbahrani8936 Місяць тому

    Perfect helpful, useful and inspiring. Thank you so much ❤

  • @MaxwellGauss-zn9yx
    @MaxwellGauss-zn9yx Місяць тому

    Brooo thxx a lot i was kinda familiar with some of these concepts but you put the dots on the points, i finally how it all works together thxx again i hope ur channel grows

  • @roro-kj2pz
    @roro-kj2pz Місяць тому

    Helpful

  • @ShopperPlug
    @ShopperPlug Місяць тому

    Excellent explanation. Reading the guidelines and this made things more clear. Would be great if you can discuss about vias.

  • @KevlarSammy
    @KevlarSammy Місяць тому

    2:42 Inserting 2&3 into what exactly? I have stared at this for 20 minutes and cannot figure it out. I did get a more straightforward for vout by plugging eq 1 into eq 2, which cancels a term.

  • @ElectroBanaana
    @ElectroBanaana Місяць тому

    Very learning thank you for this clear explanation, by the way if you could show some practical Real applications of these OAs it would be much interesting and captivating :D, maybe its done in other videos I will check once I finish this playlist :)

  • @ElectroBanaana
    @ElectroBanaana Місяць тому

    Very well explained, especially the details and maths behind it. Thanks for everything !

  • @hedleyfurio
    @hedleyfurio Місяць тому

    👍

  • @audiokees4045
    @audiokees4045 Місяць тому

    I did make a resonance smps for audio, a noise of just 390 mV did rise mine distortion of the amp from 0,.002 to 0.12 this noise is as such bad, making a transformer without the intrinsic capacitance is impossible, so using a second primary winding who a capacitor to primary ground do flip the fase 180 degree and cancel this noise. Maybe a good idea, for flyback it works. But I can also use your approach on the outputs, using a common mode filter, I did try and it drops from 390 mV to less then 7 mv.

  • @assabjorn
    @assabjorn Місяць тому

    Again thank you for we’re good explaining thank you

  • @assabjorn
    @assabjorn Місяць тому

    Weary good explaining 😊

  • @assabjorn
    @assabjorn Місяць тому

    I like this channel thank you 😊

  • @hamednisi
    @hamednisi 2 місяці тому

    Hello, I hope you're doing well. I have a deep passion for electronics and aspire to reach the level of inventing and producing a circuit board. To this end, I've completed Electronics 1 & 2, and Electrical Circuits 1 & 2 in university, but I feel like my knowledge hasn't significantly expanded. I kindly request your guidance on a roadmap or step-by-step process to become a circuit board designer, starting from a beginner level and progressing to an advanced one. Could you please outline the specific skills and knowledge I should acquire in sequential order?

  • @YassienMohamed-n3m
    @YassienMohamed-n3m 2 місяці тому

    Thank youuu, so helpfull!

  • @epsilonml7
    @epsilonml7 2 місяці тому

    thanks Lucas👍

  • @ahmednor5806
    @ahmednor5806 2 місяці тому

    💐💐💐💐

  • @vineetjain2878
    @vineetjain2878 2 місяці тому

    In the reset phase the voltage at input of inverters would be around vdd/2. This means both transistors would be on and a current will flow. There is a constant power consumption in this design for half the clock cycle. (already checdked in cadence). Can you explain what am i missing here?

  • @jluke6861
    @jluke6861 2 місяці тому

    Great Video. Thank you.

  • @michael.wilspang
    @michael.wilspang 2 місяці тому

    Hi Ko, you explain RF science very well. Keep up the excellent work; I'm sure many engineers would be happy to see them.

  • @jluke6861
    @jluke6861 2 місяці тому

    Thank you for your great video.

  • @johnaweiss
    @johnaweiss 2 місяці тому

    What's "DEM cell"? discrete element method? Digital Elevation Model?

  • @jluke6861
    @jluke6861 2 місяці тому

    Great Video and Great Explanation. Thank you for taking the time and sharing this with us.

  • @markeljanfishta6579
    @markeljanfishta6579 2 місяці тому

    Great videos. Keep it up!

  • @davideallegra8827
    @davideallegra8827 2 місяці тому

    Thank you madame. Very helpful! There is, however, a small error @ 5:04. The base and collector letters are exchanged. B should be on the left, C on the right. Just to inform you. All the other schemes are correct.

  • @jluke6861
    @jluke6861 2 місяці тому

    Great Video. Thank you for taking time and making it.

    • @koodreitz
      @koodreitz 2 місяці тому

      Thanks for your feedback!

  • @chinnamuniyandi2023jrf
    @chinnamuniyandi2023jrf 3 місяці тому

    Why can't build astable multivibrator using single inverter in a loop?

  • @JoeMama-ns8rw
    @JoeMama-ns8rw 3 місяці тому

    this was really really helpful for me thank you for alot

  • @michaelt1056
    @michaelt1056 3 місяці тому

    Is there a gate driver from Infineon that has edge shaping implemented?

  • @Yorumcu63
    @Yorumcu63 3 місяці тому

    Great video

  • @amjadtrablsi4051
    @amjadtrablsi4051 3 місяці тому

    👍👍👍

  • @sunilgodbole1854
    @sunilgodbole1854 4 місяці тому

    just a query - is there any chance that 17/09/2024 pager attacks were carried out using resonant frequencies of pager circuits ? Triggeering message might be at that resonant frequency ?

  • @PandeleimonTsoyknikidis
    @PandeleimonTsoyknikidis 4 місяці тому

    Very nice video for electrolytic caps

  • @sivakundeti2684
    @sivakundeti2684 4 місяці тому

    1.transfer cheracterstic 3.output characteristics 2.id vs vds is output characteristics but this looking different from 3rd one, What is the name of this characteristic?

  • @mtryambon
    @mtryambon 4 місяці тому

    Don’t get it. You have an input open the valve but it’s not amplifying. The higher current is already there. I was expecting the low input current being amplified to produce higher output. Like a guitar signal in and a jimmy Hendrix out. But on your example this is not the case

  • @flinfaraday1821
    @flinfaraday1821 4 місяці тому

    Why c =2*10^8?

  • @Duracellmumus
    @Duracellmumus 4 місяці тому

    The best what we can do with antenas: rotate 90° and see what will happend. This shape and the damping impedance fluctuation is analog with acustic horn.

  • @brp549
    @brp549 4 місяці тому

    Merci pour ces informations très claires et pédagogiques