Fraunhofer IZM
Fraunhofer IZM
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#µknowsbest | Lithography: A foundamental Process in Microelectronics
#Career
“The cheeks are stained with ash, but it's not the chimney sweep. A little hat with feathers, a crossbow over the shoulder, but it's not a hunter. A silver dress with a train for a ball, but it's not a princess.” ❄️✨
No question which famous Christmas movie this quote comes from! 🎄 But did you know that the classic "Drei Haselnüsse für Aschenbrödel" was filmed right next to a Fraunhofer IZM site - Dresden Moritzburg? With this edition of #µknowsbest we say goodbye for this year, but not without one last, exciting topic.
Philipp Heilfort, research associate at Fraunhofer IZM-ASSID, explains what is behind the term #lithography and how it is used in #microelectronics!
Curious? Fraunhofer IZM-ASSID celebrates its 15th anniversary in 2025! Stay up to date and find out more about the exciting work of our colleagues from Dresden-Moritzburg: ow.ly/mbIf50UltMg
#ResearchForNewcommers #Merry #Christmas
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Official website: www.izm.fraunhofer.de/​
Follow us on LinkedIn: www.linkedin.com/company/489228/
Follow us on Instagram: fraunhofer_izm?hl=de
Subscribe to our blog RealIZM: blog.izm.fraunhofer.de/
Переглядів: 33

Відео

Green ICT Online-Seminar 05: Sustainability in Information and Communication Technologies
Переглядів 76Місяць тому
Green ICT Online-Seminar 05: Sustainability in Information and Communication Technologies Speaker: Prof. Jean-Pierre Raskin, Université Catholique de Louvain Recording: November 27, 2024 In the talk, we will lift the veil on the invisibles of the digital world. Based on the assessed impacts of ICT, we will question the merits of certain technological choices made in the name of the transition. ...
Expert Session: Glass Core Substrates
Переглядів 228Місяць тому
part 4 (of 4) of our online Expert Session Series »Advanced Substrates beyond PCB« Speaker: Ruben Kahle, expert for Embedding and Substrate Technology & Julian Schwietering, expert for Optical Interconnection Technologies, Fraunhofer IZM At our R&D institute, we are deeply engaged in pioneering work on glass core substrates, a critical technology for electrical and future optical applications. ...
Fraunhofer IZM-ASSID: Get a Glimpse
Переглядів 74Місяць тому
Fraunhofer IZM’s center “All Silicon System Integration Dresden - ASSID” operates a leading-edge, industry-compatible 200 / 300 mm 3D wafer-level process line (ISO 9001-15) with modules for TSV formation, pre-assembly (thinning, singulation), wafer-level assembly and stack formation. ASSID focuses on process development, material and equipment evaluation as well as R&D services and prototyping ...
RealIZM Tech Insights: Radar Sensor Technology for Medical Diagnostics
Переглядів 54Місяць тому
For certain medical conditions, it is important to maintain continuous monitoring and control of the cardiovascular system and the respiratory function of patients. In order to be able to measure cardiovascular parameters in high resolution and without contact, the radar experts at Fraunhofer IZM at iCampµs Cottbus have adapted sensor concepts from the context of Industry 4.0 for medical diagno...
RealIZM Tech Insights: Radar-Sensorik für die medizinische Diagnostik
Переглядів 47Місяць тому
Für bestimmte Krankheitsbilder ist es wichtig, eine kontinuierliche Überwachung und Kontrolle des Herzkreislaufsystems und der Atemfunktion von Patient*innen aufrechtzuerhalten. Um hochauflösend und berührungslos Herzkreislauf-Parameter messen zu können, haben die Radar-Expert*innen des Fraunhofer IZM am iCampµs Cottbus u.a. Sensorik-Konzepte aus dem Kontext der Industrie 4.0 für die medizinisc...
Expert Session: III-V RFICs in Antenna-in-Package modules in PCB-based embedd. technology for 5G/6G
Переглядів 168Місяць тому
part 2 (of 4) of our Expert Session Series »Advanced Substrates beyond PCB« Speaker: Dr. Tekfouy Lim, expert for RF & Smart Sensor Systems, Fraunhofer IZM The wireless communication industry has been increasing operating frequencies to meet the demand for higher data rates, lower energy consumption, and reduced latency. Challenges remain in terms of decreased output power and lower efficiency a...
#µknowsbest | Reliability and Sustainability of Electronic Products
Переглядів 292 місяці тому
#Career Reliable electronics is not automatically sustainable electronics - Hans Walter from @FraunhoferIZM makes this clear in the #µknowsbest interview. However, he and his colleagues are bringing these two aspects of electronics together under the keyword “EcoReliability” and in a newly created working group on the topic. To establish the “EcoReliability - Reliable and Sustainable Electronic...
Expert Session: Fan-out Wafer & Panel Level Packaging: Platform for Gen 2/2.5 D Packaging Solutions
Переглядів 4692 місяці тому
Expert Session: Fan-out Wafer & Panel Level Packaging: Platform for Gen 2/2.5 D Packaging Solutions
Green ICT Online-Seminar 04: From CMOS Fabrication to Advanced Packaging - Ecological Aspects
Переглядів 1132 місяці тому
Green ICT Online-Seminar 04: From CMOS Fabrication to Advanced Packaging - Ecological Aspects
RealIZM Figure of the Month: Over 65,000 Micro Bumps per Chip
Переглядів 212 місяці тому
RealIZM Figure of the Month: Over 65,000 Micro Bumps per Chip
#μknowsbest | Topography Measurment for Simulation Technology
Переглядів 293 місяці тому
#μknowsbest | Topography Measurment for Simulation Technology
RealIZM Tech Insight: Jetting of Galinstan
Переглядів 683 місяці тому
RealIZM Tech Insight: Jetting of Galinstan
RealIZM Figure of the Month: 100 Blog Posts
Переглядів 103 місяці тому
RealIZM Figure of the Month: 100 Blog Posts
#µknowsbest | Broadband Antennas for Cellular Networks
Переглядів 544 місяці тому
#µknowsbest | Broadband Antennas for Cellular Networks
RealIZM Figure of the Month: 51x15mm Smartphone of the future
Переглядів 365 місяців тому
RealIZM Figure of the Month: 51x15mm Smartphone of the future
RealIZM Figure of the Month: 300 mm Wafer Process Line
Переглядів 556 місяців тому
RealIZM Figure of the Month: 300 mm Wafer Process Line
#μknowsbest | Measuring Materials through Nanoindentation
Переглядів 546 місяців тому
#μknowsbest | Measuring Materials through Nanoindentation
RealIZM Figure of the Month: 10 Nanoseconds
Переглядів 467 місяців тому
RealIZM Figure of the Month: 10 Nanoseconds
#µknowsbest | Partner School Edition #2: Cleanrooms
Переглядів 817 місяців тому
#µknowsbest | Partner School Edition #2: Cleanrooms
RealIZM Figure of the Month: -273,15° Celsius / 0 Kelvin
Переглядів 257 місяців тому
RealIZM Figure of the Month: -273,15° Celsius / 0 Kelvin
Green ICT-Kurs: Ökobilanzierung und Klimaneutralität von IKT - Basiswissen für Unternehmen
Переглядів 1138 місяців тому
Green ICT-Kurs: Ökobilanzierung und Klimaneutralität von IKT - Basiswissen für Unternehmen
Fraunhofer IZM at SMTconnect: Future Packaging Production Line
Переглядів 1148 місяців тому
Fraunhofer IZM at SMTconnect: Future Packaging Production Line
Green ICT Kurs: Robuste Prozesse der AVT unter Berücksichtigung von Nachhaltigkeitsaspekten
Переглядів 1068 місяців тому
Green ICT Kurs: Robuste Prozesse der AVT unter Berücksichtigung von Nachhaltigkeitsaspekten
#µknowsbest | Partner School Edition #1: AI
Переглядів 678 місяців тому
#µknowsbest | Partner School Edition #1: AI
Green ICT Schulung: Batterien - allgemeiner Überblick und gesetzliche Richtlinien, Teil 1
Переглядів 1139 місяців тому
Green ICT Schulung: Batterien - allgemeiner Überblick und gesetzliche Richtlinien, Teil 1
Green ICT Schulung: Batterien - Zusammensetzung und Recycling, Teil 2
Переглядів 469 місяців тому
Green ICT Schulung: Batterien - Zusammensetzung und Recycling, Teil 2
Green ICT Schulung: Grüne Zuverlässigkeit
Переглядів 489 місяців тому
Green ICT Schulung: Grüne Zuverlässigkeit
Ankündigung - Green ICT Online-Kurs: Robuste Prozesse der AVT mit Fokus auf Nachhaltigkeit
Переглядів 389 місяців тому
Ankündigung - Green ICT Online-Kurs: Robuste Prozesse der AVT mit Fokus auf Nachhaltigkeit
RealIZM Figure of the Month: 75 years Fraunhofer Gesellschaft
Переглядів 129 місяців тому
RealIZM Figure of the Month: 75 years Fraunhofer Gesellschaft

КОМЕНТАРІ

  • @youbewb5581
    @youbewb5581 2 місяці тому

    At 2:53....... What..? Really...? I....umm.... Awesome, but... Guys, c'mon. Hahahaha

  • @supersuperANANAS
    @supersuperANANAS 6 місяців тому

    very interesting, thank you for your work

  • @Stealth3008
    @Stealth3008 7 місяців тому

    That's pretty chill

  • @曹先生-d1y
    @曹先生-d1y 9 місяців тому

    cool

  • @feralbomustafa7039
    @feralbomustafa7039 9 місяців тому

    Richtig cool!

  • @nsshn9690
    @nsshn9690 9 місяців тому

    amazing... thnx a lot for this presentation and the informations

  • @TT-M
    @TT-M 10 місяців тому

    Moin, ich hätte noch 3 Fragen zum Vortrag: 1. Wie weit unterscheiden sich die hier vorgestellte _Wake-Up Technik_ von _Target Wake Time (TWT),_ welche z.b. im IEEE 802.11ah (Wi-Fi HaLow) Standard steht? Bzw. kann man mit der hier vorgestellten Technik diese IEEE Norm erfüllen? 2. Bei 1:08:00 wird beide Rechnungen mit Primärzellen durchgeführt. Könnte man nicht eine Gegenrechnung mit Sekundärzellen, wie LiFePO4 26650er mit 1W PV Modul aufstellen, welche sich immer wieder aufladen kann, um diese weitere Möglichkeit zu beleuchten? 3. Hat die ESP32-Serie von Espressif, nicht viele hier genannten Eigenschaften von Haus aus, wie etwa der ESP32-C6er?

  • @mbuchwald_atg
    @mbuchwald_atg 11 місяців тому

    Schau an, ein Silikon-Photonik-Chip bei 02:58🤦

  • @miles2378
    @miles2378 Рік тому

    4:49 why did they not make the Silicon waveguide the same width as the fibet?

    • @Fraunhofer-IZM
      @Fraunhofer-IZM Рік тому

      Hi Christopher Bloom, please find below the answer from our colleague Wojciech Lewoczko-Adamczyk: This is a very good question and the problem is well known. For some years there have been a quest among Si-PICs manufacturers to reach the goal of matching the model size of the PIC-waveguide to that of a fiber. Some attempts are "almost there" however the reason for "almost" is of technological nature: the thickness of the Si or oxide layers cannot be arbitrary and this limits the expansion of the beam size. At least at telecom wavelengths. On the other side of the coupling interface there are efforts to minimize the mode size of the fiber by using adiabatic spot-size converters, UHNA-fibers or lens fibers. Best regards

    • @miles2378
      @miles2378 Рік тому

      @@Fraunhofer-IZM thank you.

  • @nsshn9690
    @nsshn9690 Рік тому

    ich liebe diese Architektur

  • @gaussdog
    @gaussdog Рік тому

    I lived in Germany and went to public German school from the age of kindergarten through third grade… I completely forgot how you can just take 17 words and stick them together and make one word in German, until I started reading the closed captions Great Vid! Thanks

  • @guanchen4810
    @guanchen4810 Рік тому

    Thanks for the sharing.

  • @mishuk2008
    @mishuk2008 Рік тому

    At 5:39, I was expecting a sum of the field integrals in the dominator. Can you please explain why I am wrong? Thanks so much!

    • @Fraunhofer-IZM
      @Fraunhofer-IZM Рік тому

      Hi Paul Tuhin, Please find here the feedback from Wojtek regarding your question: The easiest argumentation is the check of units: if there was a sum, instead of product, in denominator, the coupling efficiency would not be unitless. For more detailed mathematical treatment please search textbooks or internet for “mode overlap integral” or “projection of wave function onto eigenstates”. Note that the mentioned wave function represents the amplitude of electric field. For calculating the power coupling efficiency you need the integrals of the square of electric field.

  • @peterdoyle8571
    @peterdoyle8571 Рік тому

    Utilizing the optical interconnect technology created by LightMatter, it would be great inspiration to the computer industry if an entire glass based motherboard was created connecting all computer components, cpu, gpu, memory, etc. via optical waveguides

  • @peterdoyle8571
    @peterdoyle8571 Рік тому

    What if Cerebras, LightMatter, UltraRam, and AMD and Nvidia came together to build a fully integrated server using panel level packaging via optical interconnects. Imagine the speed and power efficiency of said system!!!

  • @karennavia3634
    @karennavia3634 Рік тому

    🥰😋

  • @audreythornton2514
    @audreythornton2514 2 роки тому

    ✌️ ᎮᏒᎧᎷᎧᏕᎷ

  • @Voidroamer
    @Voidroamer 2 роки тому

    wow that is awesome, i had no idea! lithography on top of lithography!

  • @jenson7725
    @jenson7725 2 роки тому

    𝓹𝓻𝓸𝓶𝓸𝓼𝓶 😈

  • @feralbomustafa7039
    @feralbomustafa7039 3 роки тому

    Sehr gutes und informatives Format. Kein Wunder, dass ihr den Kommunikationspreis erhalten habt. <3

  • @meetoptics
    @meetoptics 3 роки тому

    This are the kind of presentation that photonics field needs to approach society and make people understand how our lives may improve thanks to scientific innovations and the engagement of more and more people. From MEETOPTICS we are proud to be part of the photonics community and to help engineers and researchers in their search for optical lenses through our site. We celebrate every step forward and we hope new people join our community every day!

  • @namigalasgarzade7727
    @namigalasgarzade7727 3 роки тому

    May I ask when the glass integrated waveguides seminar will take place?

    • @Fraunhofer-IZM
      @Fraunhofer-IZM 3 роки тому

      Dear @Namig Alasgarzade. The online workshop series has ended for the time being under the title »IZM Photonics: IN GLASS WE TRUST«. You can find all the other online seminars of the series on our youtube channel or on our website: www.izm.fraunhofer.de/en/news_events/trainings-and-workshops/online-sessions--izm-photonics-in-glass-we-trust.html. Stay tuned about our next online workshop series named: "»IZM PHOTONIK PACKAGING: IN OPTICAL INTERCONNECTS WE TRUST« with more interessting speakers and topics about the photonic interconnection technologies at Fraunhofer IZM.

  • @RichardKCollins
    @RichardKCollins 3 роки тому

    Optical fiber coupling to photonics chip by Wojciech Lewoczko-Adamczyk at ua-cam.com/video/rHcfemtfP2s/v-deo.html Suggest you use the whole screen for the graphs, equations, diagrams. It is too small to read easily and I do not need to see your face while you are looking at the screen. Such are called "screen videos", where you and the viewer are looking at the whole of something together. All your links are to generic pages, not to your work and these topics. The links are too vague and waste time tracking down this interesting topic. Some very nice methods, materials and components. But you are right that there is a mismatch in size and methods. My immediate impression from the mismatch would be to put an array of the chips on the whole face of the fiber, map the channel, and find optimal paths (primarily timings and correlations). If you have lots of fiber, use it. Don't make the fiber more expensive to fit one chip, just put lots of chips on existing infrastructure. It means more sensitive detectors in 2D arrays, but that is not too hard. But you can't hand if off to a graduate student. It becomes a statistical communications channel, not forcing small pieces to work together. Putting N^2 channels through an existing fiber is a fun project, and challenging enough to keep your interest. Just like disk drives and memory chips, you map the bad sectors, the bad and good channels. Some would call it "lucky imaging". It will work for copper as well. Richard Collins, Director, The Internet Foundation

    • @Fraunhofer-IZM
      @Fraunhofer-IZM 3 роки тому

      Thank you Mr. Collings for your constructive feedback. We will discuss your comments for the upcoming online workshop series and further optimise our online events. For questions regarding the content, please contact the speaker Wojciech Lewoczko-Adamczyk directly at wojciech.lewoczko-adamczyk@izm.fraunhofer.de.

    • @RichardKCollins
      @RichardKCollins 3 роки тому

      @@Fraunhofer-IZM There is a LOT of really good content on UA-cam but it is not indexed all all, and most of the groups trying to work together and share have poor tools for communicating. These comments and replies are better than nothing, but far less than ideal. Keep up the great work! Thanks for the contact information. You might consider what would be best to put in every description area of any videos you share on the Internet. UA-cam has no standards, so you will have to make up your own.

  • @MScAlchemist
    @MScAlchemist 3 роки тому

    Sehr informativ! Viel Erfolg bei den weiteren Forschungen!

  • @steveschiets
    @steveschiets 3 роки тому

    Are you familiar with polymers?

    • @Fraunhofer-IZM
      @Fraunhofer-IZM 3 роки тому

      @Steve Schiets we´re very happy about your comment. To answer your question, their will be another webinar in August about polymers itself by Dr. Alethea Vanessa Zamora Gómez. If you want to get in contact with her earlier you find her contact information here: www.izm.fraunhofer.de/en/abteilungen/system_integrationinterconnectiontechnologies/arbeitsgebiete/photonic-packaging/optische-sensorik.html

  • @arcoshpl
    @arcoshpl 4 роки тому

    gut gemacht... weiter so. Die Leistungselektronik habt ihr vergessen.. ;)

  • @andrewjar4199
    @andrewjar4199 4 роки тому

    0:34lol habe gerade Freispiele gefunden allstock.live/free-spins-bonus.php

  • @mike4tech
    @mike4tech 5 років тому

    What a beautiful video love to see the inside of this amazing institution